Printed Circuit Board Fault Inspection Based on Eddy Current Testing Using Planar Coil Sensor

Socheatra Soeung, Noohul Basheer Zain Ali, Mohd Haris Md Khir, Arash Ahmadi

Abstract


This paper presents a printed circuit board (PCB) fault inspection method using eddy current testing generated from Helmholtz coils with a planar array-coil sensor to locate and inspect short and open faults on uniformly spaced interconnect single layer PCBs. The differences between the induced voltages from fault-free boards and faulty boards will be recorded in tables and translated into contour plots. The experimental results showed that in the presence of a short fault, the differences between the induced voltages from fault-free and faulty boards are highly negative. However, in the presence of an open fault, the differences between the induced voltages from fault free and faulty boards are highly positive. These highly positive or negative induced voltages can be translated into high density color regions on contour plots. The potential fault positions can be located by observing the color regions of the contour plots with respect to each element of the matrix sensor.


Full Text: PDF DOI: 10.5539/mas.v8n2p142

Creative Commons License
This work is licensed under a Creative Commons Attribution 3.0 License.

Modern Applied Science   ISSN 1913-1844 (Print)   ISSN 1913-1852 (Online)

Copyright © Canadian Center of Science and Education

To make sure that you can receive messages from us, please add the 'ccsenet.org' domain to your e-mail 'safe list'. If you do not receive e-mail in your 'inbox', check your 'bulk mail' or 'junk mail' folders.